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    3D Packaging for Integration of Heterogeneous Systems 

    Nittala, Pavani Vamsi Krishna
    With several new applications getting developed around wearable technologies for Internet of Things (IoT), there has been a growing need for development of the miniaturized systems. Emerging applications in healthcare, ...

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    AuthorNittala, Pavani Vamsi Krishna (1)Subject
    3D packaging (1)
    CMOS (1)
    Silicon (1)
    TECHNOLOGY (1)
    Vertical stacks (1)... View MoreHas File(s)Yes (1)

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