• Login
    View Item 
    •   etd@IISc
    • Division of Electrical, Electronics, and Computer Science (EECS)
    • Electronic Systems Engineering (ESE)
    • View Item
    •   etd@IISc
    • Division of Electrical, Electronics, and Computer Science (EECS)
    • Electronic Systems Engineering (ESE)
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Studies In Micro Interconnections In Printed Wiring Board

    View/Open
    G22215.pdf (1.472Mb)
    Date
    2010-08-30
    Author
    Bhat, Shriram N
    Metadata
    Show full item record
    Abstract
    Trend towards downsizing the product size and at the same time to bring more functionality in electronic products, demands electrically interconnecting several miniaturized electronic components with high counts of I\Os (Input/Out put) on smaller and smaller size printed wiring boards [PWB]. These miniature components occupy lower foot print area but require higher routing interconnection densities. However, the conventional multilayer board technologies exhibit limitations when there is need to connect very high I\O components such as ball grid arrays, which require blind and buried interconnections within the multilayer mono-block. This limitation has given raise to newer methods of multi layer construction. Build–up multilayer PWB is now the technology of choice for enhanced routing capability including blind and buried interlayer connections. Build up methods are based on making very small vias within dielectric layers followed by metalisation. Typically blind and buried vias are very small, and hence called “micro vias” connecting the layers selectively within the multilayer mono-block. Buried vias make the interconnection between the consecutive layers, and blind vias connect the surface layers to any one of the interior layers in the build up multilayer board. If the blind vias are filled with a dielectric, the entire top and bottom surface area becomes available for high -density component mounting. The crux in build up board technologies is the method of creating micro-holes; a micro hole is a hole, which is less than 150 micro meter in diameter. Efforts are made to replace existing metalising techniques with “paste filling” methodologies, which would result in “SOLID CONDUCTING VIAS” CALLED AS “MICRO -INTERCONNECTS” The work reported in this thesis aims at demonstrating one such innovative ‘solid conducting via’ formation without using any of the known micro-hole formation techniques. Based on the results obtained some useful conclusions have been drawn which will perhaps go a long way in the name of “PRINTED PILLAR TECHNOLOGY” a novel methodology for building multilayer suitable for very high I\O components such as “ball grid arrays.”
    URI
    https://etd.iisc.ac.in/handle/2005/846
    Collections
    • Electronic Systems Engineering (ESE) [169]

    Related items

    Showing items related by title, author, creator and subject.

    • Understanding quantitative process physics of 3D binderjet printing with validation in Ti-6Al-4V and inkjet bioprinting of mammalian cells 

      Barui, Srimanta
      In the field of additive manufacturing, laser or electron beam based 3D printing is widely investigated for biomedical applications. However, much less explored is the binderjet 3D printing, which allows processing of ...
    • Fabrication, micro-computed tomography based quantitative 3D microstructure evaluation of 3D printed bioceramic scaffolds and FE modelling of biomedical implant prototypes 

      Mandal, Sourav
      In summary, this thesis provides the following outcomes: a) Formulation of novel powder-binder combination for 3D powder printing of resorbable bone-tissue scaffold. b) The effect of post-processing approach on the macro ...
    • Design and Development of Hybrid Metal and Polymer Additive Manufacturing System 

      Jayant, Hemang Kumar
      Additive manufacturing (AM) is a layer-based manufacturing process aimed at producing parts directly from a Computer-aided design (CAD) model. There are various types of AM systems, which can be classified based on: (i) ...

    etd@IISc is a joint service of SERC & J R D Tata Memorial (JRDTML) Library || Powered by DSpace software || DuraSpace
    Contact Us | Send Feedback | Thesis Templates
    Theme by 
    Atmire NV
     

     

    Browse

    All of etd@IIScCommunities & CollectionsTitlesAuthorsAdvisorsSubjectsBy Thesis Submission DateThis CollectionTitlesAuthorsAdvisorsSubjectsBy Thesis Submission Date

    My Account

    LoginRegister

    etd@IISc is a joint service of SERC & J R D Tata Memorial (JRDTML) Library || Powered by DSpace software || DuraSpace
    Contact Us | Send Feedback | Thesis Templates
    Theme by 
    Atmire NV