Show simple item record

dc.contributor.advisorRamamurthy, Praveen C
dc.contributor.advisorChoudhury, Abhik
dc.contributor.authorKaka, Fiyanshu
dc.date.accessioned2020-12-29T06:55:21Z
dc.date.available2020-12-29T06:55:21Z
dc.date.submitted2020
dc.identifier.urihttps://etd.iisc.ac.in/handle/2005/4776
dc.description.abstractOrganic Photovoltaics (OPVs) are considered to be potential contenders amongst the third-generation solar technologies. The primary reason for their popularity has been the possibility of applying various cost-effective solvent-based techniques for active layer deposition such as spin-coating, ink-jet and flexographic printing. The processing parameters influence the underlying Bulk-Heterojunction (BHJ) morphology and, subsequently, the device performance. Therefore, optimum OPV performance depends on understanding the Process-Structure-Property (PSP) correlation in organic-semiconductors. In this thesis, experiments were carried out on model P3HT:PCBM (donor-acceptor) system to study the effect of blend ratio between polymer (P3HT) and fullerene derivative (PCBM) as well as the influence of annealing time on device performance. However, since the optimization of the processing parameters, particularly for deriving active-layer BHJ morphologies with high efficiencies is non-trivial as the parameter space is large, the adoption of a theoretical framework becomes necessary. In the theoretical framework, we present an approach for deriving both the process-structure and structure-property correlations based on the diffuse-interface method. Herein, we derive process-structure correlations using phase-field simulations based on the Cahn-Hilliard formalism for modelling phase-separation. Utilizing the process-structure model, a range of morphologies as a result of processing parameters such as blend ratio, annealing time, and evaporation rate of solvent are generated. Thereafter, we derive the structure-property correlations again using a diffuse interface approach for calculating the electronic properties such as the efficiency, fill-factor, short-circuit current, and the open-circuit voltages for the simulated microstructures. Thus, using a combination of the process--structure and structure-property correlations, optimal compositions can be determined. Since donor-acceptor OPVs possess a limited absorption of the solar spectrum, and the addition of a ternary component with a complementary absorption spectrum addresses this issue, we carried out experimental studies on donor-acceptor-acceptor OPVs. Here, experiments exploring the effect of blend ratio on device performance were carried out on PTB7-Th, Coi8DFIC, and PCBM ternary system. The experiments motivated the numerical studies wherein the PSP relationship in ternary OPVs was optimized using the above-mentioned theoretical framework. Further, in order to expedite the theoretical prediction, a robust and elegant data analytics model is built using dimensionality reduction techniques. This work is done in the broad overview of the Integrated Computational Materials Engineering (ICME) framework wherein the processing parameters are optimised by determining the process-structure-property relationships.en_US
dc.description.sponsorshipDSTen_US
dc.language.isoen_USen_US
dc.rightsI grant Indian Institute of Science the right to archive and to make available my thesis or dissertation in whole or in part in all forms of media, now hereafter known. I retain all proprietary rights, such as patent rights. I also retain the right to use in future works (such as articles or books) all or part of this thesis or dissertationen_US
dc.subjectPhase-field modellingen_US
dc.subjectOrganic Photovoltaicsen_US
dc.subject.classificationResearch Subject Categories::TECHNOLOGY::Electrical engineering, electronics and photonicsen_US
dc.titleNumerical and experimental investigation of Process-Structure-Property relationship in Organic Photovoltaicsen_US
dc.typeThesisen_US
dc.degree.namePhDen_US
dc.degree.levelDoctoralen_US
dc.degree.grantorIndian Institute of Scienceen_US
dc.degree.disciplineEngineeringen_US


Files in this item

This item appears in the following Collection(s)

Show simple item record