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Mechanical Reliability of Metal-Si Systems at different Length scales under Thermal Cyclic Loading
Metal structures of nanometer to micrometer sizes in different configurations, such as thin films, thick coatings and 3D interconnects, are widely used for conducting electrical signals in several semiconductor-based ...
Interfacial Processes in Densification of Cubic Zirconia
(2018-02-21)
Sintering, a process of forming dense solid bodies from powder compacts remains the most important route for processing of ceramics. The process of sintering involves formation and growth of necks during initial stage, ...
Dynamic Strain Aging and Creep in near-α Ti Alloy, IMI834
IMI 834 is a near- Ti alloy used in high temperature applications such as compressor discs and blades of aero engines. Titanium alloys including IMI 834 are known to exhibit dynamic strain aging (DSA) over the temperature ...
Nano Surface Modifications for Anti-Corrosive and Anti-Biofouling Applications
Microbially Induced Corrosion (MIC) of materials is a major concern of marine
industry. Various ferrous and non-ferrous materials used in industry are prone to MIC.
Bio-fouling or formation of bio-film on material surface ...
Influence of Electric Field on the Global and Local Structure in the Ferroelectric Ceramic Na1/2Bi1/2TiO3 and its Solid Solutions with BaTiO3 and K1/2Bi1/2TiO3
(2018-08-14)
Ferroelectric ceramics are very promising materials for a variety of piezoelectric applications such as high permittivity dielectrics, piezoelectric sensors, piezoelectric/electrostrictive transducers, actuators, electro-optic ...
Diffusion Controlled Growth of A15-Based Nb3Sn and V3Ga Intermetallic Compounds
(2018-08-09)
The A15-based Nb3Sn and V3Ga superconducting compounds are an integral part of synchrotrons and magnetic fusion reactor technology, especially where a magnetic field higher than 10 T is required, which lies beyond the limit ...
Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging
(2018-08-28)
The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs ...
Precipitate Growth and Coarsening in Ternary Alloys
(2018-08-20)
We have studied precipitate growth and coarsening in ternary alloys using two different phase held models.
The first one is a ternary extension of the classical Cahn-Hilliard (C-H) model in which both the phases are ...
Studies On Thermodynamics And Phase Equilibria Of Selected Oxide Systems
(2013-02-20)
The availability of high quality thermodynamic data on solid solutions and compounds present in multicomponent systems assists in optimizing processing parameters for synthesis, and in evaluating stability domains and ...
Engineering Bioactive And Multifunctional Graphene Polymer Composites for Bone Tissue Regeneration
(2017-09-26)
The growing incidences of orthopedic problems globally have created a huge demand for strong bioactive materials for bone tissue engineering. Over the years, studies have shown chemical, physical, and mechanical properties ...