Browsing Materials Engineering (MatEng) by Advisor "Kumar, Praveen"
Now showing items 1-10 of 10
-
Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging
(2018-08-28)The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs ... -
Effect of High-Pressure Torsion and Natural Ageing on Hardness, Electrical Resistivity and Fatigue Properties of Commercially Pure Cu
Commercially pure Cu was processed through high-pressure torsion (HPT) at a pressure of 6 GPa starting from ¼ up to 50 turns. These samples were then naturally aged for 1.75 years under the laboratory condition. Subsequently, ... -
Effect of Length Scale on High Temperature Mechanical Behavior of Sn-Cu Joints: A Mechanics and Material Science Based Treatment
With the ongoing miniaturization of microelectronic devices, the size of compliant solder in microscale solder joints has significantly reduced, proportion of brittle phases has increased, and the microscale joints have ... -
Effect of Sintering on Microstructure and Mechanical Properties of Air Plasma Sprayed 7 wt.% Y2O3 Stabilized ZrO2
Air plasma sprayed (APS) 7 wt.% Y2O3 stabilized ZrO2 (7YSZ) coating is conventionally used for thermal insulations (in form of thermal barrier coating, TBC) in various hotter sections of land-based gas turbine engines and ... -
Evaluation of Low-stress High-temperature Creep: Insights into the Harper-dorn Creep
The theory of creep behavior of single crystals and polycrystalline materials having large grains at very low-stresses and at very high temperatures, as originally proposed by Harper and Dorn in 1957, has been under constant ... -
Evaluation of Power-Law Creep in Bending
Materials for engineering components operating at high temperatures during their service like rockets, aero-turbines, automobile engines, nuclear power plants, steam power plants and micro-electronics are often designed ... -
Extraction of Creep Parameters from Indentation Creep Experiment: An Artificial Neural Network- Based Approach
Conventional methods for extracting creep properties require conducting several uniaxial tests at different loads, which consumes an intensive amount of material and time. Indentation may minimize the material volume ... -
Mass Transport in Cu-Interlayer-Si Systems under Various Thermo-Electro-Mechanical Excursions
This work falls in general area of the electro-thermo-mechanical driven mass transport in Cu-Si systems, which often finds relevance while accessing reliability issues pertaining to thin film interconnects in microelectronic ... -
Mechanical Reliability of Metal-Si Systems at different Length scales under Thermal Cyclic Loading
Metal structures of nanometer to micrometer sizes in different configurations, such as thin films, thick coatings and 3D interconnects, are widely used for conducting electrical signals in several semiconductor-based ... -
Numerical Simulations on the Indentation Behaviour of Shape Memory Alloys
Shape Memory Alloys (SMAs) are increasingly being used as micro actuators, sensors, as self expanding cardiovascular stents and in MEMs based devices because of their ability to recover large values of imposed strain. ...