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dc.contributor.advisorNarasimhan, R
dc.contributor.authorVanimisetti, Sampath Kumar
dc.date.accessioned2011-06-23T10:14:29Z
dc.date.accessioned2018-07-31T05:46:04Z
dc.date.available2011-06-23T10:14:29Z
dc.date.available2018-07-31T05:46:04Z
dc.date.issued2011-06-23
dc.date.submitted2004
dc.identifier.urihttps://etd.iisc.ac.in/handle/2005/1239
dc.identifier.abstracthttp://etd.iisc.ac.in/static/etd/abstracts/1613/G18913-Abs.pdfen_US
dc.language.isoen_USen_US
dc.relation.ispartofseriesG18913en_US
dc.subjectThin Film Devicesen_US
dc.subjectSurface Coatingen_US
dc.subjectThin Filmsen_US
dc.subjectIndentationen_US
dc.subject.classificationElectronic Engineeringen_US
dc.titleA Numerical Study Of Deformation And Fracture Of Thin Hard Films On Soft Substrates Subjected To Indentationen_US
dc.typeThesisen_US
dc.degree.nameMSc Enggen_US
dc.degree.levelMastersen_US
dc.degree.disciplineFaculty of Engineeringen_US


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