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Interfacial Processes in Densification of Cubic Zirconia
(2018-02-21)
Sintering, a process of forming dense solid bodies from powder compacts remains the most important route for processing of ceramics. The process of sintering involves formation and growth of necks during initial stage, ...
Length Scale Effects in Deformation of Polycrystalline Nickel
(2017-09-20)
The demand for compact, efficient and high performance electronic devices and sensor systems has become one of the primary driving force for rapid advancement in miniaturization of current technology. However, the attempt ...
Influence of Electric Field on the Global and Local Structure in the Ferroelectric Ceramic Na1/2Bi1/2TiO3 and its Solid Solutions with BaTiO3 and K1/2Bi1/2TiO3
(2018-08-14)
Ferroelectric ceramics are very promising materials for a variety of piezoelectric applications such as high permittivity dielectrics, piezoelectric sensors, piezoelectric/electrostrictive transducers, actuators, electro-optic ...
Hyaluronic Acid Based Biodegradable Polyelectrolyte Nanocapsules and Modified Protein Nanoparticles for Targeted Delivery of Anticancer Agents
(2018-08-02)
Targeted delivery aids in minimizing most of the drug-originated systemic toxic effects as well as improving the pharmacokinetic properties of anticancer therapeutics. Tumor targeting using hyaluronic acid (HA) as the ...
Diffusion Controlled Growth of A15-Based Nb3Sn and V3Ga Intermetallic Compounds
(2018-08-09)
The A15-based Nb3Sn and V3Ga superconducting compounds are an integral part of synchrotrons and magnetic fusion reactor technology, especially where a magnetic field higher than 10 T is required, which lies beyond the limit ...
On the Factors Influencing the Stability of Phases in the Multiferroic System BiFeO3-PbTiO3
(2018-08-11)
Rhombohedral perovskite BiFeO3 is a single phase multiferroic compound exhibiting both magnetic (Neel temperature ~370˚C) and ferroelectric (Curie point ~840˚C) ordering well above the room temperature. Ferroelectricity ...
Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging
(2018-08-28)
The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs ...
Precipitate Growth and Coarsening in Ternary Alloys
(2018-08-20)
We have studied precipitate growth and coarsening in ternary alloys using two different phase held models.
The first one is a ternary extension of the classical Cahn-Hilliard (C-H) model in which both the phases are ...