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Effect of Length Scale on High Temperature Mechanical Behavior of Sn-Cu Joints: A Mechanics and Material Science Based Treatment
With the ongoing miniaturization of microelectronic devices, the size of compliant solder in microscale solder joints has significantly reduced, proportion of brittle phases has increased, and the microscale joints have ...
Printed and Low Temperature Processed Oxide Electronics with Superior Electrical Performance and Mechanical Reliability
In line with the forthcoming industrial revolution, printed and flexible electronics is a rapidly developing research area that involves wearable and consumer electronics to be produced in large quantities and be connected ...
Graphene derivatives sandwiched with porous polyvinylidene fluoride based thin film composite membranes for effective water remediation
Safe drinking water for all is perhaps one of the prime nexus of the 21st century and one of the prime sustainable development goals. Around 1.2 billion people still lack access to safe potable water, while around 2.6 ...
Effect of Cobalt Content on Microstructure and Strength in Severely Cold Drawn Ni-Co wires
The future upcoming technologies in aerospace, transport and nuclear industries demand materials with superior mechanical properties that are also economically viable. The quest to achieve theoretical strength of material ...
Extraction of Equivalent Uniaxial Plastic and Viscoplastic Behavior from Bending Using a Mechanistic Approach
The present work is aimed at the extraction of material’s yield and creep parameters using
cantilevers by conducting constant deflection rate and constant load tests respectively.
Under the assumption of Euler-Bernoulli’s ...
PDMS-Based Nanocomposite for EMI Shielding application
Lightweight, flexible, and easy-to-integrate solutions are in great demand in electronic devices. The present work deals with the preparation of Poly dimethyl siloxane (PDMS) based nanocomposite for suppressing electromagnetic ...
Inkjet-Printed Co-continuous Mesoporous Oxides for Surface Dominated Functional Devices
Over the last few decades, printed and flexible electronics have emerged as a major area of research, which may cater multiple domains of application requirements for the forthcoming industrial revolution. The solution ...
Mechanical Reliability of Metal-Si Systems at different Length scales under Thermal Cyclic Loading
Metal structures of nanometer to micrometer sizes in different configurations, such as thin films, thick coatings and 3D interconnects, are widely used for conducting electrical signals in several semiconductor-based ...
Structure-Property correlation in epoxy composites containing carbonaceous nanoparticles
Epoxy is widely used as thermosetting materials in carbon fiber composites due to its combined superior thermal and mechanical properties which makes them a potential candidate for myriad applications. But epoxy suffers ...
Microstructure and texture evolution in wire drawing and its role on the tension and torsion response of nickel microwires
It is now well known that the strength of the metallic materials depends on microstructural features such as dislocation density, grain size, and precipitates. The migration of lattice defects such as dislocations is a ...