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Prediction Of The Mechanical Behaviour Of A Closed Cell Aluminium Foam Using Advanced Nonlinear Finite Element Modelling
(2016-05-06)
Cellular materials like aluminum foam which is the subject of interest here are generally characterized by high energy absorption capacity per unit weight. Materials of this category can be ideal for applications such as ...
Experimental and Numerical Investigation of Mode I Fracture Behavior in Magnesium Single Crystals
(2018-04-02)
Magnesium alloys, owing to their low density and high specific strength, are potential candidates for structural applications in automotive and aerospace industry. While considerable research effort has been devoted in ...
Developement Of Aluminium Foam : An Experimental And Numerical Study
(2010-07-06)
Metal foams are lightweight structures and have large use in many components acting as impact energy absorbers. They have exceptional mechanical, thermal and acoustic properties. The design or selection of foam for packaging ...
Resculpting In Voxel Modeling
(2011-11-11)
Interfacial Processes in Densification of Cubic Zirconia
(2018-02-21)
Sintering, a process of forming dense solid bodies from powder compacts remains the most important route for processing of ceramics. The process of sintering involves formation and growth of necks during initial stage, ...
Influence of Electric Field on the Global and Local Structure in the Ferroelectric Ceramic Na1/2Bi1/2TiO3 and its Solid Solutions with BaTiO3 and K1/2Bi1/2TiO3
(2018-08-14)
Ferroelectric ceramics are very promising materials for a variety of piezoelectric applications such as high permittivity dielectrics, piezoelectric sensors, piezoelectric/electrostrictive transducers, actuators, electro-optic ...
Diffusion Controlled Growth of A15-Based Nb3Sn and V3Ga Intermetallic Compounds
(2018-08-09)
The A15-based Nb3Sn and V3Ga superconducting compounds are an integral part of synchrotrons and magnetic fusion reactor technology, especially where a magnetic field higher than 10 T is required, which lies beyond the limit ...
Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging
(2018-08-28)
The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs ...
Precipitate Growth and Coarsening in Ternary Alloys
(2018-08-20)
We have studied precipitate growth and coarsening in ternary alloys using two different phase held models.
The first one is a ternary extension of the classical Cahn-Hilliard (C-H) model in which both the phases are ...