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    Stress and Microstructural Evolution During the Growth of Transition Metal Oxide Thin Films by PVD 

    Narayanachari, K V L V (2018-05-23)
    System on Chip (SoC) and System in Package (SiP) are two electronic technologies that involve integrating multiple functionalities onto a single platform. When the platform is a single wafer, as in SOC, it requires the ...

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    Author
    Narayanachari, K V L V (1)
    SubjectBaTiO3 Thin Films (1)Materials Science (1)Oxide Thin Film Growth (1)Oxides On Silicon (1)Physical Vapor Deposition (1)
    Pulsed Laser Ablation (1)
    Sputter Deposition (1)
    SrTiO3 Thin Films (1)
    System On Chip (SoC) (1)System on Package (SiP) (1)... View MoreDate Issued
    2018 (1)
    Has File(s)
    Yes (1)

    etd@IISc is a joint service of SERC & J R D Tata Memorial (JRDTML) Library || Powered by DSpace software || DuraSpace
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